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Samsung hosts ceremony to mark first delivery of most advanced 3nm chips

SEOUL, July 25 (Yonhap) — Samsung Electronics Co. marked the first delivery of 3-nanometer semiconductors on Monday at a ceremony, a key milestone in the race to build the most advanced and effective to date.

The next-generation 3nm chips are built on Gate-All-Around (GAA) technology, which Samsung says will eventually enable up to 35% area reduction, while delivering 30% better performance and 50% lower power consumption, compared to the existing FinFET process.

Samsung said its first-generation 3nm process node achieves 16% area reduction, 23% higher performance, and 45% lower power consumption.

The advancement of sophisticated chip-making technology, which has happened faster than Taiwan’s foundry rival TSMC, is expected to bring Samsung to more customers looking for powerful chips enabling smaller, faster technology products. and more efficient.

“Samsung today opened a new chapter in the foundry industry, with the start of mass production of 3nm chips,” said Kyung Kye-hyun, CEO of Samsung’s Device Solutions Division. , which oversees the chip business, at the ceremony at its Hwaseong production lines. , some 40 kilometers south of Seoul.

“The development of GAA technology earlier than expected as an alternative to the FinFET process was an innovative breakthrough,” Kyung said.

Samsung said it started developing GAA technology in the early 2000s and in 2017 succeeded in applying it to the 3nm node. The tech giant said high-performance computing is the first product developed based on 3nm GAA technology and plans to expand the application to other product categories.

Industry Minister Lee Chang-yang, who attended the ceremony, vowed to “spare no effort to fully support the semiconductor industry,” based on the government’s long-term policy. aimed at stimulating the industry by helping to develop talent, providing financial support and creating a healthy environment. flea ecosystem.

Since the third quarter of last year, the world’s largest memory chipmaker has been collaborating with partners including German technology company Siemens and US silicon design firm Synopsys, which are members of the Samsung Advanced Foundry Ecosystem ( SAFETM), to provide its foundry customers with chip design infrastructure and other services.

The South Korean tech giant presented its 3nm chips to US President Joe Biden in May during his visit to Samsung’s Pyeongtaek complex, the world’s largest semiconductor factory located about 70 kilometers south of Seoul. .

TSMC, the world’s largest contract chipmaker, said it would begin mass production of 3nm chips in the second half of the year.

The two companies have been in fierce competition to outdo each other in bringing the most advanced and efficient chips to the mass market and to win customers for contract chip manufacturing.

Samsung, the world’s largest memory chipmaker and second-largest foundry player, said its 2nm process node is in the early stages of development, with mass production planned for 2025.

According to industry tracker TrendForce, TSMC took 53.5% of the global foundry market, followed by Samsung with 16.3%, in the first quarter of this year.

In 2019, Samsung unveiled a massive 171 trillion won ($151 billion) investment plan in the logic chip and foundry sectors by 2030, as the tech giant plans to expand its leadership beyond the memory sector.

Last month, it unveiled additional chip investment plans, vowing to cement its leadership position and try to improve its contract chip manufacturing business and create a fabless ecosystem in Korea. from South.